This expensive and valuable diamond has been cut to perfection. Laser MicroJet technology ensures minimal weight loss thanks to parallel cutting.

Natural Diamond

Cutting

LMJ is used to downsize 450mm silicon semiconductor wafers to 300mm and 200mm wafers, without any impact on the material.

Silicon

Downsizing

Silicon frames are very brittle and request a gentle processing technology without any micro cracks and chipping. LMJ reaches high accuracy, straight walls, low roughness and is highly flexible.

Silicon

Cutting

CVD Crystal

Slicing, Coring

The use of LMJ ensures a high quality coring and slicing process of CVD crystals and smooth surfaces as well as low roughness what requires minimal post treatments.

CVD Crystal

Slicing, Coring

LMJ used for prototyping on CuBe, damage-free cutting and drilling. LMJ has high flexibility for lower production volumes, no deburring needed.

CuBe

Drilling, Cutting, Prototyping

Fabricating top quality discs made of Binderless Polycrystalline Diamond with LMJ is less time- and tool-consuming than with conventional methods such as grinding.

Binderless Polycrystalline Diamond (BLPCD)

Cutting

When cutting CBN (Cubic Boron Nitride) blanks with LMJ the result exceeds the quality of dry laser cutting as heat damages and rough edges are avoided.

Polycrystalline Cubic Boron Nitride (CBN)

Cutting

Synova’s Laser MicroJet (LMJ) is used to cut difficult-to-machine metal alloys for electrical components reaching high edge quality and accuracy.

Metal Alloys

Cutting

Synova’s Laser Cutting System (LCS) 800 was used for job shop of high precision parts. In this case, throughput and flexibility increased while quality remained the same as with etching and electroforming.

Metal

Cutting

LMJ is the perfect choice to cut silicon carbide which is a challenging material to cut because of its hardness and brittleness. In this case it is used for IGTB Power Chips.

Silicon Carbide

Edge Grinding, Edge Trimming

LED chips and packages are made of materials that are frequently difficult to cut mechanically. With LMJ one has high flexibility regarding materials and shapes.

Indium Gallium Nitride

Cutting

Nitinol

Cutting

The LMJ is used to cut oscillating monolithic parts with complex shapes without deformation or heat affected zone but with the capacity to cut very thin bridges.

Steel, Copper

Cutting

The main challenge to cut platinum electrodes is to reach to the electrode which is welded more than 20mm deep in a cylinder. Processing with LMJ is much faster than with EDM.

Platinum

Cutting

LMJ was chosen to dice sensitive platinum-iridium detectors in the form of microchips, it has several advantages over blade sawing.

Platinum-Iridium

Dicing, Single Die Cutting

The silicon blades for the first single-use, safety engineered surgical knife designed for use in cutting corneal tissue were cut with Synova’s LMJ.

Silicon

Cutting

Gold

Cutting

The LMJ is used to cut large series of up to 2mm thick decorative watch components.

Gold, Steel, Brass

Drilling, Cutting

Tungsten, Carbide Substrate

Finishing

CVD Crystal

Slicing, Coring

With LMJ, it was possible to establish a repeatabel, high-speed process for singulating substrates without damaging the adjacent circuitry.

Ceramics

Dicing

The LMJ is used for gentle, precise, and fast processing for large inline production of power semiconductor devices. Low contamination of the workpiece is crucial.

Silicon

Cutting

The LMJ is used for gentle, precise, and fast processing for large inline production of power semiconductor devices. Low contamination of the workpiece is crucial.

Silicon

Cutting

Alloys

Drilling, Shaping

Drilling of via holes in ceramic substrates of thin film circuits with LMJ eliminates the hole-cleaning step and reduces cost of ownership versus CO2 lasers.

Metal Deposition, Photolithography

Drilling

Synova’s Laser MicroJet (LMJ) was used to drill cooling holes in turbine blades in coated superalloy. Chipping or micro cracking of the coating can be avoided thanks to this gentle process.

Coated Superalloy

Drilling

LMJ is used to trim edges of CMOS image sensors and proves superiority over EDM by significantly higher quality.

Silicon

Edge Trimming, Downsizing

The LMJ is advantageously for fancy bruting due the its perfect cut at the outline of the diamond to create the shape profile. Less post-processing is required.

Natural Diamond

Bruting

High-speed drilling of shaped holes in blades and vanes with LMJ for industrial gas turbines, no thermal stress and minimal recast.

Alloys

Drilling, Shaping

LMJ, heat damage-free processing high-tech components; medtech, micro-machining.

Various

Drilling, Cutting, Prototyping

Laser MicroJet (LMJ) is used for micro-machining of high-tech components for the watch, medtech, space and defense industry. It is the perfect tool for flexible, stable and heat damage-free processes.

Various

Micro-Machining

To link the diamond with the other jewellery part, a hole-drilling process might be required. With LMJ the drilled holes are fully straight, no V-shape, no chipping at the hole entry and exit.

Natural Diamond

Hole-Drilling

The LMJ is used for cutting components with free froms with high accuracy requirements (± 5 μm) from CVD crystals.

CVD Crystal

Slicing, Coring, 3D Form Cuts

The LMJ is used for micromachining of high-tech parts reaching top quality/tolerances and better return on investment.

Metal, Ceramics

Drilling, Cutting

When using LMJ to cut diamond tool inserts 99% of the diamond material can be removed at high speed before a final polishing step.

HPHT Crystal

Pre-Cutting

LMJ: aero-engine components. Drilling, milling, cutting up to a few mm thickness.

Ceramic Matrix Composite (CMC), Ni Superalloy

Cutting, Drilling, Milling

Synova’s Laser MicroJet (LMJ) was used to drill Ceramic Matrix Composite (CMC) shrouds. Laser MicroJet’s gentle, precise, and high-volume processing for an exigent aero application is of advantage.

Ceramic Matrix Composite (CMC)

Drilling

Synova’s Laser MicroJet (LMJ) was used to drill Ceramic Matrix Composite (CMC) shrouds. Laser MicroJet’s gentle, precise, and high-volume processing for an exigent aero application is of advantage.

Ceramic Matrix Composite (CMC)

Drilling

Ceramics, Silicon, Silicon Carbide, Advanced Composites

Drilling

LMJ is used to cut and drill thin nickel masks, so called shadow mask patterning. Nickel foils are challenging to cut/ablate due to the large size and low thickness.

Nickel Foils

Drilling, Cutting

LMJ for prototyping, cutting, drilling of demanding shaver caps. Requirements met: damage-free, vertical, and precise processing.

Stainless Steel

Drilling, Cutting, Prototyping

The LMJ  is used for hexagonal square or circular dies singulation for PressFIT Diodes and achieves a much better edge quality compared to grinding.

Silicon with gold coating

Cutting

The aim is to obtain a maximum number of slices from the CVD crystal. Cutting with a constant parallel kerf and without tapering with LMJ ensures a higher yield.

CVD Crystal

Slicing

The aim is to obtain a maximum number of slices from the CVD crystal. Cutting with a constant parallel kerf and without tapering with LMJ ensures a higher yield.

CVD Crystal

Slicing

The goal is to get a maximum number of slices out of the HPHT crystal (high pressure, high temperature) and to cut variable thicknesses ranging up to 12 mm.

HPHT Crystal

Slicing

Synova’s Laser MicroJet’s (LMJ) higher quality 3D machining of inserts and complex multi-tip tools enables new applications with better operating cost.

Tungsten

Cutting

Thin wafers are challenging to manipulate and to process due to the high flexibility and fragility. With LMJ the perfect TAIKO ring removal becomes possible.

Silicon

Cutting

The 813-carat Constellation Diamond is the most expensive rough diamond in the world. The resulting 313-carat ‘Constellation One’ is the largest D color emerald cut diamond ever.

Natural Diamond

Cutting

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Natural Diamond

Cutting

The 342-carat rough diamond has resulted in a set of 23 diamonds, the Garden of Kalahari. Highest precision could be achieved thanks to LMJ.

Natural Diamond

Cutting

LMJ: wafer dicing, device singulation. Elimination of high operational costs for blades.

Natural Diamond, Silicon Carbide, Advanced Materials such as GaN

Dicing, Singulation