Discover How Our Clients Use LMJ Systems

Through our custom solutions, we help clients to be one step ahead of the competition. Take a look at the case studies below to get a detailed insight of some past customer applications

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  • Diamond

    143.45 Carat Diamond

    Case Study

    143.45 Carat Diamond

    Diamond
    Challenge

    This expensive and valuable diamond has been cut to perfection. Laser MicroJet technology ensures minimal weight loss thanks to parallel cutting.

    Material

    Natural Diamond

    Process

    Cutting

  • Semiconductors

    Chamfer Cutting

    Case Study

    Chamfer Cutting

    Semiconductors
    Challenge

    LMJ is used to downsize 450mm silicon semiconductor wafers to 300mm and 200mm wafers, without any impact on the material.

    Material

    Silicon

    Process

    Downsizing

  • Semiconductors and Photovoltaics

    Complementary Metal Oxide

    Case Study

    Complementary Metal Oxide

    Semiconductors and Photovoltaics
    Challenge

    Silicon frames are very brittle and request a gentle processing technology without any micro cracks and chipping. LMJ reaches high accuracy, straight walls, low roughness and is highly flexible.

    Material

    Silicon

    Process

    Cutting

  • DiamondIndustrial diamonds

    Coring and Slicing of a CVD Crystal

    Case Study

    Coring and Slicing of a CVD Crystal

    DiamondIndustrial diamonds
    Challenge

    With LMJ there was an improvement in yield, straightness, smoothness, cracks, and throughput in coring and slicing CVD crystals.

    Material

    CVD Crystal

    Process

    Slicing, Coring

  • DiamondIndustrial diamonds

    Coring for Graphite Removal

    Case Study

    Coring for Graphite Removal

    DiamondIndustrial diamonds
    Challenge

    The use of LMJ ensures a high quality coring and slicing process of CVD crystals and smooth surfaces as well as low roughness what requires minimal post treatments.

    Material

    CVD Crystal

    Process

    Slicing, Coring

  • HighlightedOthers

    CuBe

    Case Study

    CuBe

    HighlightedOthers
    Challenge

    LMJ used for prototyping on CuBe, damage-free cutting and drilling. LMJ has high flexibility for lower production volumes, no deburring needed.

    Material

    CuBe

    Process

    Drilling, Cutting, Prototyping

  • OthersTool Manufacturing

    Cutting of Binderless Polycrystalline Diamond

    Case Study

    Cutting of Binderless Polycrystalline Diamond

    OthersTool Manufacturing
    Challenge

    Fabricating top quality discs made of Binderless Polycrystalline Diamond with LMJ is less time- and tool-consuming than with conventional methods such as grinding.

    Material

    Binderless Polycrystalline Diamond (BLPCD)

    Process

    Cutting

  • OthersTool Manufacturing

    Cutting of CBN Blanks without Heat Damage

    Case Study

    Cutting of CBN Blanks without Heat Damage

    OthersTool Manufacturing
    Challenge

    When cutting CBN (Cubic Boron Nitride) blanks with LMJ the result exceeds the quality of dry laser cutting as heat damages and rough edges are avoided.

    Material

    Polycrystalline Cubic Boron Nitride (CBN)

    Process

    Cutting

  • Others

    Cutting of Electrical Components

    Case Study

    Cutting of Electrical Components

    Others
    Challenge

    Synova’s Laser MicroJet (LMJ) is used to cut difficult-to-machine metal alloys for electrical components reaching high edge quality and accuracy.

    Material

    Metal Alloys

    Process

    Cutting

  • Others

    Cutting of High-Precision Metal Parts

    Case Study

    Cutting of High-Precision Metal Parts

    Others
    Challenge

    Synova’s Laser Cutting System (LCS) 800 was used for job shop of high precision parts. In this case, throughput and flexibility increased while quality remained the same as with etching and electroforming.

    Material

    Metal

    Process

    Cutting

  • Semiconductors and Photovoltaics

    Cutting of IGTB Power Chips

    Case Study

    Cutting of IGTB Power Chips

    Semiconductors and Photovoltaics
    Challenge

    LMJ is the perfect choice to cut silicon carbide which is a challenging material to cut because of its hardness and brittleness. In this case it is used for IGTB Power Chips.

    Material

    Silicon Carbide

    Process

    Edge Grinding, Edge Trimming

  • Semiconductors and Photovoltaics

    Cutting of LED Chips

    Case Study

    Cutting of LED Chips

    Semiconductors and Photovoltaics
    Challenge

    LED chips and packages are made of materials that are frequently difficult to cut mechanically. With LMJ one has high flexibility regarding materials and shapes.

    Material

    Indium Gallium Nitride

    Process

    Cutting

  • Medical

    Cutting of Nitinol Stents

    Case Study

    Cutting of Nitinol Stents

    Medical
    Challenge

    LMJ was the perfect choice to receive a controlled/homogeneous roughness, narrow tolerances, no HAZ, and no reduction in strength cut cardiovasculaire stents.

    Material

    Nitinol

    Process

    Cutting

  • HighlightedOthersWatchmaking

    Cutting of Oscillating Parts

    Case Study

    Cutting of Oscillating Parts

    HighlightedOthersWatchmaking
    Challenge

    The LMJ is used to cut oscillating monolithic parts with complex shapes without deformation or heat affected zone but with the capacity to cut very thin bridges.

    Material

    Steel, Copper

    Process

    Cutting

  • Others

    Cutting of Platinum Electrodes

    Case Study

    Cutting of Platinum Electrodes

    Others
    Challenge

    The main challenge to cut platinum electrodes is to reach to the electrode which is welded more than 20mm deep in a cylinder. Processing with LMJ is much faster than with EDM.

    Material

    Platinum

    Process

    Cutting

  • Semiconductors

    Cutting of Platinum-Iridium

    Case Study

    Cutting of Platinum-Iridium

    Semiconductors
    Challenge

    LMJ was chosen to dice sensitive platinum-iridium detectors in the form of microchips, it has several advantages over blade sawing.

    Material

    Platinum-Iridium

    Process

    Dicing, Single Die Cutting

  • Medical

    Cutting of Silicon Blades

    Case Study

    Cutting of Silicon Blades

    Medical
    Challenge

    The silicon blades for the first single-use, safety engineered surgical knife designed for use in cutting corneal tissue were cut with Synova’s LMJ.

    Material

    Silicon

    Process

    Cutting

  • Watchmaking

    Cutting of Watch Components for Luxury Watches

    Case Study

    Cutting of Watch Components for Luxury Watches

    Watchmaking
    Challenge

    With very short warm-up and set-up times Synova’s Laser MicroJet (LMJ) is a flexible and stable tool to cut watch components for luxury watches, no matter if it’s for production or prototyping.

    Material

    Gold

    Process

    Cutting

  • OthersWatchmaking

    Cutting of Watch Dials and Markers

    Case Study

    Cutting of Watch Dials and Markers

    OthersWatchmaking
    Challenge

    The LMJ is used to cut large series of up to 2mm thick decorative watch components.

    Material

    Gold, Steel, Brass

    Process

    Drilling, Cutting

  • HighlightedOthersTool Manufacturing

    Cutting PCD and CBN Tools

    Case Study

    Cutting PCD and CBN Tools

    HighlightedOthersTool Manufacturing
    Challenge

    Cutting PCD, CBN tools: no micro cracks, HAZ, oxidation possible with LMJ. Verticality, narrow tolerances, low roughness, and sharp edges.

    Material

    Tungsten, Carbide Substrate

    Process

    Finishing

  • DiamondIndustrial diamonds

    CVD Seed Slicing

    Case Study

    CVD Seed Slicing

    DiamondIndustrial diamonds
    Challenge

    The challenge was to slice large CVD crystals (chemical vapor deposition) of up to 25 mm from a single direction and along the largest thickness, with a high quality.

    Material

    CVD Crystal

    Process

    Slicing, Coring

  • Semiconductors

    Dicing of Ceramic Circuits

    Case Study

    Dicing of Ceramic Circuits

    Semiconductors
    Challenge

    With LMJ, it was possible to establish a repeatabel, high-speed process for singulating substrates without damaging the adjacent circuitry.

    Material

    Ceramics

    Process

    Dicing

  • Synova Case study

    Downsizing of Silicon Wafers

    Case Study

    Downsizing of Silicon Wafers

    Synova Case study
    Challenge

    The LMJ is used for gentle, precise, and fast processing for large inline production of power semiconductor devicesLow contamination of the workpiece is crucial.

    Material

    Silicon

    Process

    Cutting

  • HighlightedSemiconductors

    Downsizing of Silicon Wafers

    Case Study

    Downsizing of Silicon Wafers

    HighlightedSemiconductors
    Challenge

    The LMJ is used for gentle, precise, and fast processing for large inline production of power semiconductor devicesLow contamination of the workpiece is crucial.

    Material

    Silicon

    Process

    Cutting

  • Aerospace

    Drilling of Gas Turbine Blades

    Case Study

    Drilling of Gas Turbine Blades

    Aerospace
    Challenge

    Drilling of industrial gas turnine blades by avoiding heat related problems and maintaining high productivity by the use of LMJ.

    Material

    Alloys

    Process

    Drilling, Shaping

  • Semiconductors and Photovoltaics

    Drilling of Holes in Ceramic Substrates

    Case Study

    Drilling of Holes in Ceramic Substrates

    Semiconductors and Photovoltaics
    Challenge

    Drilling of via holes in ceramic substrates of thin film circuits with LMJ eliminates the hole-cleaning step and reduces cost of ownership versus CO2 lasers.

    Material

    Metal Deposition, Photolithography

    Process

    Drilling

  • Aerospace

    Drilling of Turbine Blades

    Case Study

    Drilling of Turbine Blades

    Aerospace
    Challenge

    Synova’s Laser MicroJet (LMJ) was used to drill cooling holes in turbine blades in coated superalloy. Chipping or micro cracking of the coating can be avoided thanks to this gentle process.

    Material

    Coated Superalloy

    Process

    Drilling

  • Semiconductors and Photovoltaics

    Edge Trimming of CMOS Image Sensors

    Case Study

    Edge Trimming of CMOS Image Sensors

    Semiconductors and Photovoltaics
    Challenge

    LMJ is used to trim edges of CMOS image sensors and proves superiority over EDM by significantly higher quality.

    Material

    Silicon

    Process

    Edge Trimming, Downsizing

  • DiamondJewelry

    Fancy Bruting

    Case Study

    Fancy Bruting

    DiamondJewelry
    Challenge

    The LMJ is advantageously for fancy bruting due the its perfect cut at the outline of the diamond to create the shape profile. Less post-processing is required.

    Material

    Natural Diamond

    Process

    Bruting

  • AerospaceHighlighted

    High-Speed Drilling of Shaped Holes

    Case Study

    High-Speed Drilling of Shaped Holes

    AerospaceHighlighted
    Challenge

    High-speed drilling of shaped holes in blades and vanes with LMJ for industrial gas turbines, no thermal stress and minimal recast.

    Material

    Alloys

    Process

    Drilling, Shaping

  • Others

    High-Tech Components

    Case Study

    High-Tech Components

    Others
    Challenge

    LMJ, heat damage-free processing high-tech components; medtech, micro-machining.

    Material

    Various

    Process

    Drilling, Cutting, Prototyping

  • Others

    High-Tech Parts

    Case Study

    High-Tech Parts

    Others
    Challenge

    Laser MicroJet (LMJ) is used for micro-machining of high-tech components for the watch, medtech, space and defense industry. It is the perfect tool for flexible, stable and heat damage-free processes.

    Material

    Various

    Process

    Micro-Machining

  • DiamondJewelry

    Hole Drilling for Jewellery

    Case Study

    Hole Drilling for Jewellery

    DiamondJewelry
    Challenge

    To link the diamond with the other jewellery part, a hole-drilling process might be required. With LMJ the drilled holes are fully straight, no V-shape, no chipping at the hole entry and exit.

    Material

    Natural Diamond

    Process

    Hole-Drilling

  • DiamondHighlightedIndustrial diamonds

    Lab Grown Diamond Material for Industry

    Case Study

    Lab Grown Diamond Material for Industry

    DiamondHighlightedIndustrial diamonds
    Challenge

    The LMJ is used for cutting components with free froms with high accuracy requirements (± 5 μm) from CVD crystals.

    Material

    CVD Crystal

    Process

    Slicing, Coring, 3D Form Cuts

  • OthersWatchmaking

    Micro-Machining of High-Tech Parts

    Case Study

    Micro-Machining of High-Tech Parts

    OthersWatchmaking
    Challenge

    The LMJ is used for micromachining of high-tech parts reaching top quality/tolerances and better return on investment.

    Material

    Metal, Ceramics

    Process

    Drilling, Cutting

  • OthersTool Manufacturing

    Pre-Cutting of Tool Inserts

    Case Study

    Pre-Cutting of Tool Inserts

    OthersTool Manufacturing
    Challenge

    When using LMJ to cut diamond tool inserts 99% of the diamond material can be removed at high speed before a final polishing step.

    Material

    HPHT Crystal

    Process

    Pre-Cutting

  • AerospaceHighlighted

    Processing of Aero-Engine Components

    Case Study

    Processing of Aero-Engine Components

    AerospaceHighlighted
    Challenge

    LMJ: aero-engine components. Drilling, milling, cutting up to a few mm thickness.

    Material

    Ceramic Matrix Composite (CMC), Ni Superalloy

    Process

    Cutting, Drilling, Milling

  • Synova Case study

    Processing of CMC Shrouds

    Case Study

    Processing of CMC Shrouds

    Synova Case study
    Challenge

    Synova’s Laser MicroJet (LMJ) was used to drill Ceramic Matrix Composite (CMCshrouds. Laser MicroJet’s gentle, precise, and high-volume processing for an exigent aero application is of advantage.

    Material

    Ceramic Matrix Composite (CMC)

    Process

    Drilling

  • AerospaceHighlighted

    Processing of CMC Shrouds

    Case Study

    Processing of CMC Shrouds

    AerospaceHighlighted
    Challenge

    Synova’s Laser MicroJet (LMJ) was used to drill Ceramic Matrix Composite (CMCshrouds. Laser MicroJet’s gentle, precise, and high-volume processing for an exigent aero application is of advantage.

    Material

    Ceramic Matrix Composite (CMC)

    Process

    Drilling

  • HighlightedSemiconductors

    Semiconductor Reactor Sub-Assemblies

    Case Study

    Semiconductor Reactor Sub-Assemblies

    HighlightedSemiconductors
    Challenge

    LMJ is used for micro-machining semiconductor reactor sub-assembly parts with tight tolerances on thick,  hard materials in contact with reactive gas.

    Material

    Ceramics, Silicon, Silicon Carbide, Advanced Composites

    Process

    Drilling

  • Others

    Shadow Mask Patterning

    Case Study

    Shadow Mask Patterning

    Others
    Challenge

    LMJ is used to cut and drill thin nickel masks, so called shadow mask patterning. Nickel foils are challenging to cut/ablate due to the large size and low thickness.

    Material

    Nickel Foils

    Process

    Drilling, Cutting

  • Others

    Shaver Caps

    Case Study

    Shaver Caps

    Others
    Challenge

    LMJ for prototyping, cutting, drilling of demanding shaver caps. Requirements met: damage-free, vertical, and precise processing.

    Material

    Stainless Steel

    Process

    Drilling, Cutting, Prototyping

  • Semiconductors

    Singulation of Silicon Wafers

    Case Study

    Singulation of Silicon Wafers

    Semiconductors
    Challenge

    The LMJ  is used for hexagonal square or circular dies singulation for PressFIT Diodes and achieves a much better edge quality compared to grinding.

    Material

    Silicon with gold coating

    Process

    Cutting

  • Synova Case study

    Slicing of a CVD Crystal

    Case Study

    Slicing of a CVD Crystal

    Synova Case study
    Challenge

    The aim is to obtain a maximum number of slices from the CVD crystal. Cutting with a constant parallel kerf and without tapering with LMJ ensures a higher yield.

    Material

    CVD Crystal

    Process

    Slicing

  • DiamondHighlightedIndustrial diamonds

    Slicing of a CVD Crystal

    Case Study

    Slicing of a CVD Crystal

    DiamondHighlightedIndustrial diamonds
    Challenge

    The aim is to obtain a maximum number of slices from the CVD crystal. Cutting with a constant parallel kerf and without tapering with LMJ ensures a higher yield.

    Material

    CVD Crystal

    Process

    Slicing

  • DiamondIndustrial diamonds

    Slicing of a HPHT Diamond

    Case Study

    Slicing of a HPHT Diamond

    DiamondIndustrial diamonds
    Challenge

    The goal is to get a maximum number of slices out of the HPHT crystal (high pressure, high temperature) and to cut variable thicknesses ranging up to 12 mm.

    Material

    HPHT Crystal

    Process

    Slicing

  • HighlightedOthersTool Manufacturing

    Super Hard Tool Making

    Case Study

    Super Hard Tool Making

    HighlightedOthersTool Manufacturing
    Challenge

    Synova’s Laser MicroJet’s (LMJ) higher quality 3D machining of inserts and complex multi-tip tools enables new applications with better operating cost.

    Material

    Tungsten

    Process

    Cutting

  • HighlightedSemiconductors

    Taiko Ring Removal

    Case Study

    Taiko Ring Removal

    HighlightedSemiconductors
    Challenge

    Thin wafers are challenging to manipulate and to process due to the high flexibility and fragility. With LMJ the perfect TAIKO ring removal becomes possible.

    Material

    Silicon

    Process

    Cutting

  • Diamond

    The Constellation

    Case Study

    The Constellation

    Diamond
    Challenge

    The 813-carat Constellation Diamond is the most expensive rough diamond in the world. The resulting 313-carat ‘Constellation One’ is the largest D color emerald cut diamond ever.

    Material

    Natural Diamond

    Process

    Cutting

  • Diamond

    The Graff Lasedi La Rona

    Case Study

    The Graff Lasedi La Rona

    Diamond
    Challenge

    Lorem ipsum…

    Material

    Natural Diamond

    Process

    Cutting

  • Diamond

    The Queen of Kalahari

    Case Study

    The Queen of Kalahari

    Diamond
    Challenge

    The 342-carat rough diamond has resulted in a set of 23 diamonds, the Garden of Kalahari. Highest precision could be achieved thanks to LMJ.

    Material

    Natural Diamond

    Process

    Cutting

  • Semiconductors

    Wafer Dicing

    Case Study

    Wafer Dicing

    Semiconductors
    Challenge

    LMJ: wafer dicing, device singulation. Elimination of high operational costs for blades.

    Material

    Natural Diamond, Silicon Carbide, Advanced Materials such as GaN

    Process

    Dicing, Singulation

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