Synova’s unique water jet guided laser systems offer many advantages for applications in the semiconductor industry compared to conventional diamond blade saws or laser systems. The Laser MicroJet® combines the accuracy of a laser with the cooling and guiding capabilities of a thin water jet. This unique approach results in smooth edges, high wafer fracture strength, and less risk of breakage.

The LMJ is ideally suited for processing a wide range of semiconductor materials, including silicon (Si), gallium arsenide (GaAs), silicon carbide (SiC), low-K materials and even coated materials such as Epoxy molded compound wafers of various thicknesses. Thanks to its minimal thermal impact, the LMJ ensures that material integrity is preserved throughout the entire cutting process.

Typical semiconductor applications include wafer downsizing, wafer trimming, edge grinding, and wafer dicing. The LMJ is also used for processing semiconductor equipment and consumables, including hole drilling, slot cutting, etching, and the machining of special shapes.