DCS 150 - SYNOVA

DCS 150

The DCS 150 is Synova’s diamond cutting system for small and medium-sized natural and laboratory grown diamonds. The 3-axis machine allows sawing rough diamonds with a size of 2 grz. to 4 cts. and coring and slicing of CVD diamonds.

Since no focal adjustment is required, a working distance and cutting depth of up to 30 millimeters is possible. Thus, a diamond can be cut in a single setting rather than from both sides, as it is the case with conventional lasers.

Materials

Diamond materials: Rough diamonds,Laboratory grown diamonds (CVD, HPHT)

Operations

3-axis machine: Sawing, coring, slicing

Key Benefits

Easy
- No focus control necessary due to long working distance
- No blackening, no opening, no double sawing needed
- Very little post treatment required
Profitable
- Minimal weight loss and low risk of breakage
- Fast cutting time and easy processing
- Diamond sawing in mass production
Straight and Smooth
- Smooth cutting surfaces and sharp edges
- Highly accurate and perfectly parallel cuts (no V-shape)
- Cool and clean laser machining process

Typical Application Examples

Diamond sawing

118 cts stone

Diamond sawing

200 cts stone

Pie cutting

12.35 cts stone

Pie cutting

4 cts stone

Hole drilling

Natural stone

General Specifications

		DCS 150
Working volume	mm (W x D x H)	150 x 150 x 100
Accuracy	µm	+/- 5
Repeatability	µm	+/- 2
Number of axes		3-axis
Laser Type		Diode pumped solid state Nd: YAG, pulsed
Wavelength	nm	532
Dimensions machine	mm (W x D x H)	1050 x 800 x 1870
Dimensions cabinet	mm (W x D x H)	700 x 2300 x 1600

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