DCS 300 - SYNOVA

DCS 300

This diamond cutting system with a working area of 300 x 300 mm is particularly well suited for cutting larger diamonds having a size of 5 carats or more. It offers sawing and pie sawing capabilities for natural diamonds and coring and slicing of CVD diamonds.

Since no focal adjustment is required, a working distance and cutting depth of up to 30 millimeters is possible. Thus, a diamond can be cut in a single setting rather than from both sides, as it is the case with conventional lasers.

Materials

Diamond materials: Rough diamonds,Laboratory grown diamonds (CVD, HPHT)

Operations

3-axis machine: Sawing, pie sawing, coring, slicing

Key Benefits

Easy
- No focus control necessary due to long working distance
- No blackening, no opening, no double sawing needed
- Very little post treatment required
Profitable
- Minimal weight loss and low risk of breakage
- Fast cutting time and easy processing
- Diamond sawing in mass production
Straight and Smooth
- Smooth cutting surfaces and sharp edges
- Highly accurate and perfectly parallel cuts (no V-shape)
- Cool and clean laser machining process

Typical Application Examples

Diamond sawing

200 cts stone

Diamond sawing

813 cts stone

Pie cutting

12.35 cts stone

Pie cutting

4 cts stone

Bruting

302 cts stone

General Specifications

		DCS 300
Working volume	mm (W x D x H)	300 x 300 x 100
Accuracy	µm	+/- 3
Repeatability	µm	+/- 1
Number of axes		3-axis
Laser Type		Diode pumped solid state Nd: YAG, pulsed
Wavelength	nm	532
Dimensions machine	mm (WxDxH)	1165 x 950 x 1920
Dimensions cabinet	mm (WxDxH)	700 x 2300 x 1600

Are you interested in a demo?

Fill out the form and we’ll get back to you as soon as possible.