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LCS 150
LCS 150

The LCS 150 is a versatile 3-axis laser cutting system designed for micro-machining applications, including cutting, drilling, or grooving for a variety of industrial sectors. This compact and efficient machine is compatible with various laser sources, offering power levels of up to 200 W.

The machine uses linear X- and Y-motor axes in a cross table and the work piece is fixed on a M6-thread table. An optional B rotary axis can be mounted on the table allowing positioning the work piece with a different rotation angle.

The state-of-the-art CNC machine system includes a high-power green laser, a compact high-pressure water pump with an ultra-pure water unit, a touch-screen control panel and a vision system with motorized zoom.

Materials

Diamond materials: Polycrystalline CBN (PcBN), polycrystalline diamonds (PCD), monocrystalline diamonds (MCD), chemical-vapor-deposition (CVD) diamonds, natural diamond (ND), tungsten carbide (WC)  

Metals and alloys: Stainless steel, Durnico, CuBe, copper, brass, aluminum, shape-memory alloys (Nitinol), titanium, nickel, super alloys etc.  

Ceramics: Zirconia (ZrO2), LTCC (low-temperature co-fired ceramic), Aluminum-nitride (AlN), Aluminum-oxide (Al2O3)

Operations

3-axis machine: 2D cutting, drilling, slicing, grooving, engraving

 

Key Benefits

  • Sharp and Smooth
    • Cylindrical beam resulting in parallel kerfs (no V-shape)
    • Smooth cutting surfaces and sharp edges (Ra  as low as 0.15 μm)
    • Virtually no heat impact thanks to water jet cooling capability
  • Fast and Accurate
    • Cutting of 1.6 mm PCD and cemented carbide in 5 mm/ min. No limit in thickness.
    • High mechanical precision with a tolerance of less than +/- 3 μm
    • Very small kerf width (down to 30 μm)
  • Clean and Easy
    • Clean surfaces and no depositions
    • No or very little post treatment required
    • No focus control necessary due to long working distance
 

Typical Application Examples

Wafer singulation
Gold-plated Silicon
Solar cells
Silicon
Epicyclic gear train
Titanium
Electronics
Copper
Thin ceramic
Alumina

General Specifications

LCS 150
Working volume 125 x 200 x 100
Accuracy +/- 3
Repeatability +/- 2
Laser type Diode-pumped solid-state laser
Laser power 50 W – 350 W
Number of axes 3
Machine dimensions W 1050 mm x D 1200 mm x H 2500 mm
Machine weight approx. 1400 kg
Utilities cabinet dimensions W 1800 mm x D 700 mm x H 1600 mm

Facility information

LCS 150
Ambient temperature min 18 °C – max 28 °C, recommended  20 °C ± 2 °C
Ambient air humidity < 90%, non-condensing
Electricity input 3x 400 VAC +6% / -10%, 3-phases 50/60 Hz ± 1%
Compressed air pressure requirement 5 – 6 bar
Water quality requirement City water
Water pressure requirement 2.5 – 4 bar
Drain flow rate < 2 l/min

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