Home / Laser Cutting Systems (LCS) / LCS 800
LCS 800
LCS 800

The 3-axis laser cutting machine LCS 800 is a robust and versatile system conceived for a multitude of high-precision cutting and drilling applications in different industrial sectors. The large mounting table allows machining of virtually any part size and is suited for small series and prototypes but also for large volumes.

Main applications include machining of semiconductor equipment sub-assemblies, metal masks and other components made of metal, ceramics or composites (e.g. silicon carbide, CFRP).

The LCS 800 has an intuitive and fully integrated system control interface with touchscreen functionality. The offset calibration system integrates automatic laser-nozzle alignment, automatic jet angle correction (both optional) and laser power control.

Materials

Diamond materials: Polycrystalline CBN (PcBN), polycrystalline diamond (PCD), single crystalline diamond (SCD), CVD diamond, natural diamond, tungsten carbide (WC)

Metals and alloys: Stainless steel, aluminum, copper, nickel, titanium, superalloys, etc.

Ceramics: Silicon carbide (SiC), silicon nitride (SiN), ceramic-matrix composites (CMCs), CFRP, Zirconia (ZrO2), HTCC/LTCC, aluminium nitride (AlN), aluminium oxide (Al2O3)

Operations

2D cutting, drilling, slicing, slotting, grooving, pocketing, milling, engraving, profiling

Key Benefits

  • Sharp & Smooth
    • Cylindrical beam resulting in parallel kerfs (no V-shape)
    • Smooth cutting surfaces and sharp edges
    • Virtually no heat impact thanks to water jet cooling capability
  • Fast and Accurate
    • Cutting of 10 mm CBN in 26.5 mm/min.
    • High mechanical precision with a tolerance of less than +/- 8 μm
    • Very small kerf width (down to 30 μm)
  • Clean and Easy
    • Clean surfaces, no depositions or burrs
    • No or very little post treatment required
    • No laser focusing or distance control required

Typical Application Examples

Aerospace structure
CFRP
Ingot trimming
Silicon carbide
Wafer downsizing
Silicon
Thick metal cutting
Metal
OLED evaporation mask
Metal

General Specifications

 

LCS 800
Working volume 690 x 630 x 100
Accuracy +/- 8 µm
Repeatability +/- 5 µm
Laser type Diode-pumped solid-state laser
Laser power 50 W – 350 W
Number of axes 3
Machine dimensions W 2000 mm x D 1650 mm x H 3000 mm
Machine weight approx. 3500 kg
Utilities cabinet dimensions W 1800 mm x D 700 mm x H 1600 mm

Facility information

LCS 800
Ambient temperature min 18 °C – max 28 °C, recommended  20 °C ± 2 °C
Ambient air humidity < 90%, non-condensing
Electricity input 3x 400 VAC +6% / -10%, 3-phases 50/60 Hz ± 1%
Compressed air pressure requirement 5 – 6 bar
Water quality requirement City water
Water pressure requirement 2.5 – 4 bar
Drain flow rate < 2 l/min

Are you interested in a demo?

Fill out the form and we’ll get back to you as soon as possible.

Contact Us
laser-target