SPS 300 M - SYNOVA

SPS 300 M

The S-50 with 3 or 5 axes is Synova’s most compact and cost-efficient Laser MicroJet® machine. This system is ideal for machining industrial diamond tools, watch components and other small work pieces that require precision cutting, drilling, grooving or slicing as well as 3D processing.

The machine uses linear motor axes (LCS 50-3) and additional B and C rotary axes with torque motors enabling 3D cutting and shaping (S-50-5).

The state-of-the-art CNC machine system includes a high-power green laser, a compact high-pressure water pump with an ultra-pure water unit, a 21.5-inch touch-screen control panel and a vision system with motorized zoom.

Materials

Diamond materials: Natural and lab-grown diamonds (CVD, HPHT), polycrystalline diamond (PCD), single crystalline diamond (SCD)

Metals and alloys: Stainless steel, aluminium, Durnico, Phynox, CuBe, copper, brass, gold, shape-memory alloys (nitinol, cobalt-chrome), titanium, nickel, superalloys

Ceramics: Zirconia (ZrO2), HTCC/LTCC, aluminium nitride (AlN), alumina (Al2O3), silicon nitride (SiN), Polycrystalline cBN (PcBN), tungsten carbide (WC)

Composites: Ceramic-matrix composites (CMCs), diamond-SiC/cBN composites, carbon fiber reinforced polymer (CFRP)

Operations

3 axis machine: 2D cutting, drilling, pocketing, slicing, surface texturing

Key Benefits

Smooth and Gentle
- Smooth edges
- High wafer fracture strength and less risk of breakage
- Virtually no heat impact thanks to water jet cooling capability
Fast and Accurate
- Cutting speed of up to 200 mm/s for thin wafers (< 50 µm)
- High precision with a tolerance of +/- 3 μm
- Very small kerf width (down to 30 μm)
Clean and Easy
- Clean surfaces and no depositions
- No or very little post treatment required
- No focus control necessary due to long working distance

Typical Application Examples

Synthetic Diamond

Slicing of CVD diamonds

Consumer Electronics

Cutting of CuBe connectors

General Specifications

Version		LDS 300 M
Working volume	mm (W x D)	300 x 300
Accuracy	µm	+/- 3
Repeatability	µm	+/- 1
Number of axes		2-axis
Laser Type		Diode pumped solid state Nd: YAG, pulsed
Wavelength	nm	532/ 1064
Dimensions machine	mm (W x D x H)	1165 x 950 x 1920
Dimensions cabinet	mm (W x D x H)	700 x 2300 x 1600

Facility information

Version		LDS 300 M
Working volume	mm (W x D)	300 x 300
Accuracy	µm	+/- 3
Repeatability	µm	+/- 1
Number of axes		2-axis
Laser Type		Diode pumped solid state Nd: YAG, pulsed
Wavelength	nm	532/ 1064
Dimensions machine	mm (W x D x H)	1165 x 950 x 1920
Dimensions cabinet	mm (W x D x H)	700 x 2300 x 1600

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