The Unique Strenghts of the Laser MicroJet®

A unique cylindrical laser beam

A unique cylindrical laser beam

Very small kerf width (down to 30 µm)

Parallel cut and vertical walls (no taper)

No focusing or distance control required

Less material damages due to water cooling

Low heat impact (no HAZ)

No material change

High fracture strength

No particle depositions or contamination

High accuracy and quality

High accuracy and quality

High mechanical µm precision

High quality edges

Low roughness

No micro-cracks

Smooth surface

Efficiency

Efficiency

Fast machining

Low running costs

Low need of consumables

Minimal material loss and reduced waste

High aspect ratio

High aspect ratio

Hole-drilling with an aspect ratio up to 1:20 (diameter by depth)

Materials

Our laser MicroJet technology offers great results for the machining of a wide range of materials, whether conductive or not. It is particularly well suited for the processing of ultra-hard materials, such as super alloys, or of complex materials, such as CMCs.

Anvils

Diamond materials

Natural and lab-grown diamonds (CVD, HPHT), polycrystalline diamond (PCD), single crystalline diamond (SCD)

Metals and alloys

Stainless steel, aluminium, Durnico, Phynox, CuBe, copper, brass, gold, shape-memory alloys (nitinol, cobalt-chrome), titanium, nickel, superalloys

Ceramics

Zirconia (ZrO2), HTCC/LTCC, aluminium nitride (AlN), alumina (Al2O3), silicon nitride (SiN), Polycrystalline cBN (PcBN), tungsten carbide (WC)

Semiconductors

Silicon (Si), gallium arsenide (GaAs), silicon carbide (SiC)

Composites

Ceramic matrix composites (CMCs), diamond-SiC/cBN composites, carbon fiber reinforced polymer (CFRP)

SYNOVA

Operations

Synova’s product portfolio, ranging from 2 to 5 axis machines, provides perfect flexibility and enables manufacturers to find the perfect fit for their applications. In addition, thanks to it’s versatile technology, the laser MicroJet can be used for a multitude of processes while achieving unparalleled precision. Our systems can perform complex operations such as:

Cutting
Drilling
Turning

Pocketing
Chamfering
3D cutting

Advantages of Laser MicroJet®
over alternative cutting methods

Synova Laser MicroJet® compared to Conventional lasers
  • no heat affected zones
  • cleaner and smoother cuts
  • parallel kerf walls
Synova Laser MicroJet® compared to USP lasers (pico/femto second)
  • faster cutting speeds
  • parallel kerf walls
  • cleaner cuts

 

Synova Laser MicroJet® compared to Wire EDM
  • not limited to conductive materials
  • no pre-drilled hole required
  • lower running cost
Synova Laser MicroJet® compared to Waterjet
  • higher precision
  • narrower kerf width
  • smoother surface with no delamination
Synova Laser MicroJet® compared to Miling and sawing
  • no tool wear
  • reduced mechanical stress on the material
  • improved surface quality
Editor notice: In the sidebar of the Technology Benefits subpage you can add more Advantages!

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