Watch our latest application video showcasing high-precision tube processing. Discover how our 5-axis S-50 machine, powered by our proprietary Laser MicroJet®, achieves outstanding cutting precision, making it an ideal solution for small workpieces in the medical industry.

Discover the capabilities of our LCS 303 3-axis laser cutting system while processing a wafer for the semiconductor industry. Whether it’s wafer downsizing, notch, or flat cutting, our Laser MicroJet® is renowned for its high precision and reliability.

Experience the precision of our Laser MicroJet® technology as it processes a SiC wafer for the semiconductor industry. This video showcases our S-303 machine executing multiple cutting shapes, including wafer dicing, hole drilling, and sharp triangles cutting.

Engineered for the precision cutting of small workpieces, our 5-axis machines effortlessly handle even the most complex 3D applications. With a dynamic moving axis and advanced water jet guided laser, our technology can achieve incredible results with no limit to your creativity!

Discover the capabilities of our LCS 303 3-axis machine while cutting one of the toughest materials: Ceramic Matrix Composites. Cutting this ultra-hard and brittle material is particularly challenging, but our laser MicroJet® excels in handling even the most demanding materials with exceptional precision.

Explore the capabilities of our Laser MicroJet® as it tackles the challenge of cutting Ceramic Matrix Composites, one of the toughest materials around. Our system guarantees precise and clean cuts without causing thermal damage, making it ideal for working with hard and brittle materials.

Watch how a small piece of stainless steel is cut and shaped into a delicate lady figure by our Laser Microjet®. Our water jet guided laser can remove the material in a single operation, ensuring no thermal damage and preserving a smooth surface with impeccably sharp edges.

Discover the capabilities of our water jet laser as it effortlessly cuts through a 0.65 mm-thick alumina ceramic plate. Experience the finesse of our cutting applications, from slotting to drilling, all while maintaining flawless precision that prevents micro-cracks and thermal damage.

Our LCS 303 can process a wide variety of materials, from ultra hard and brittle materials such as ceramics, to complex composites. In this video, you will see how our laser cut through a 15 mm thick piece of Zirconia toughened Alumina without inducing any micro-cracks.

The “DaVinci Diamond Factory” is an automated laser cutting & shaping system for diamonds. In this video, you see the processes involved in cutting a 4 mm thick CVD diamond, from planning to determining the facet cutting order and alignment to shaping the heart in one go.

Cutting oscillating masses made out of heavy metals such as tungsten is a demanding task because tungsten is a difficult material to machine. In this video, you will see how precisely the LCS 303 cuts fancy shapes of oscillating masses without thermal damage or deformation.

See how the water jet guided Laser MicroJet® effortlessly cuts tough titanium and challenging ceramics. The LCS 303 laser cutting system produces intricate functional parts with minimal material loss and excellent surface quality.